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| MP03 XXX 330 Series MP03 XXX 330 Series Phase Control Dual SCR, SCR/Diode Modules Replaces December 1998 version, DS4483-4.0 DS4483-5.0 January 2000 FEATURES s Dual Device Module s Electrically Isolated Package s Pressure Contact Construction s International Standard Footprint s Alumina (non-toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Control s AC Phase Control VOLTAGE RATINGS Type Number Repetitive Peak Voltages VDRM VRRM Conditions Code KEY PARAMETERS 1200V VDRM ITSM 10600A IT(AV) (per arm) 334A 2500V Visol CIRCUIT OPTIONS Circuit HBT HBP HBN PACKAGE OUTLINE MP03/330 - 12 MP03/330 - 10 MP03/330 - 08 1200 1000 800 T(vj) = 130oC IDRM = IRRM = 30mA VDSM & VRSM = VDRM & VRRM+ 100V respectively Lower voltage grades available. For full description of part number see "Ordering instructions" on page 3. CURRENT RATINGS - PER ARM Symbol Parameter Module type code: MP03. See Package Details for further information Conditions Max. Units Tcase = 75oC Tcase = 85oC IT(AV) Mean on-state current Halfwave, resistive load Theatsink = 75oC Theatsink = 85oC IT(RMS) RMS value Tcase = 75oC 334 289 259 223 525 A A A A A 1/10 MP03 XXX 330 Series SURGE RATINGS - PER ARM Symbol Parameter Conditions Max. Units ITSM Surge (non-repetitive) on-state current V =0 10ms half sine; R Tj = 130C VR = 50% VRRM 10ms half sine; Tj = 130C VR = 0 VR = 50% VRRM 10.6 8.5 0.56 x 106 0.36 x 106 A kA A2s A2s It 2 I t for fusing 2 THERMAL & MECHANICAL RATINGS Symbol Parameter Conditions Max. Units o dc Rth(j-c) Thermal resistance - junction to case per Thyristor or Diode halfwave 3 phase Rth(c-hs) Tvj Tstg Visol Thermal resistance - case to heatsink per thyristor or diode Virtual junction temperature Storage temperature range Isolation voltage Commoned terminals to base plate AC RMS, 1min, 50Hz Mounting torque = 5Nm with mounting compound Off-state (Blocking) 0.11 0.12 0.13 0.05 130 -40 to 130 2.5 C/W o C/W C/W C/W o o o C o C kV DYNAMIC CHARACTERISTICS- THYRISTOR Symbol Parameter Conditions Max. Units VTM IRRM/IDRM dV/dt dI/dt VT(TO) rT On-state voltage Peak reverse and off-state current Linear rate of rise of off-state voltage At 1000A, Tcase = 25oC At VRRM/VDRM, Tj = 130oC To 67% VDRM Tj = 130oC From 67% VDRM to 600A Gate source 10V, 5 Rise time 0.5s, Tj =130oC At Tvj = 130oC At Tvj = 130oC 1.50 30 200* V mA V/s Rate of rise of on-state current Threshold voltage On-state slope resistance 100 0.8 0.7 A/s V m * Higher dV/dt values available, contact factory for particular requirements. Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor. 2/10 MP03 XXX 330 Series GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Conditions Typ. Max. Units VGT IGT VGD VFGM VFGN VRGM IFGM PGM PG(AV) Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak forward gate voltage Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power VDRM = 5V, Tcase = 25oC VDRM = 5V, Tcase = 25oC At VDRM Tcase = 25oC Anode positive with respect to cathode Anode negative with respect to cathode - 3.0 150 0.25 30 0.25 5.0 10 100 5 V mA V V V V A W W Anode positive with respect to cathode tp = 25s - ORDERING INSTRUCTIONS Part number is made up of as follows: MP03 HBT 330 -10 MP 03 HBT 330 10 = Pressure contact module = Outline type = Circuit configuration code (see "circuit options" - front page) = Nominal average current rating at Tcase = 75oC = VRRM/100 Examples: MP03 HBP330 - 08 MP03 HBN330 - 12 MP03 HBT330 - 08 NOTE: Diode ratings and characteristics are comparable with the SCR in types HBP or HBN Types HBP or HBN can also be supplied with diode polarity reversed, to special order. MOUNTING RECOMMENDATIONS s Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of VT(TO) and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. s The heatsink surface must be smooth and flat; a surface finish of N6 (32in) and a flatness within 0.05mm (0.002") are recommended. s Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain. s An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. s After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends. s It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module. 3/10 MP03 XXX 330 Series CURVES 1600 Measured under pulse conditions Instantaneous on-state current - (A) 1200 800 Tj = 130C 400 0 1.2 1.4 1.6 1.8 0.6 0.8 1.0 Instantaneous on-state voltage - (V) Fig. 1 Maximum (limit) on-state characteristics (thyristor or diode) - See Note 1 100 Table gives pulse power PGM in Watts Pulse Width s 20 25 100 500 1ms 10ms Frequency Hz 50 100 400 100 100 100 100 100 100 100 100 100 100 100 25 100 50 10 Tj = -40C Tj = 25C Tj = 125C % 9 it 9 m i rL pe Up 0W 10 W 75 W 50 10 W 5W VFGM Gate trigger voltage - (V) 10 0.1 0.001 0.01 IGD 0.1 0.1 Gate trigger current - (A) FIG 2 GATE CHARACTERISTICS Fig. 2 Gate trigger characteristics Lo w er L im 1 it 1 Region of certain triggering % 10 IFGM 4/10 MP03 XXX 330 Series 0.15 Thermal impedance - (C/W) d.c. 0.10 0.05 0 0.001 0.01 0.1 Time - (s) 1.0 10 100 Fig. 3 Transient thermal impedance (DC) - (Thyristor or diode) Peak half sine wave on-state current - (kA) 20 I2t = I2 x t 2 15 500 450 10 I2t 5 400 350 300 250 200 0 1 ms 10 1 2 3 45 150 50 I2t value - (A2s x 103) Cycles at 50Hz Duration Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRRM, Tcase = 130C (Thyristor or diode) 5/10 MP03 XXX 330 Series 500 180 450 120 On-state power loss per device - (W) 400 350 30 300 250 200 150 100 50 0 60 90 0 50 100 150 200 250 Mean on-state current - (A) 300 350 400 Fig. 5 On-state power loss per arm vs forward current at various conduction angles, sine wave, 50/60Hz 500 450 90 On-state power loss per device - (W) 180 120 d.c. 400 60 350 30 300 250 200 150 100 50 0 0 50 100 150 200 250 Mean on-state current - (A) 300 350 400 Fig. 6 On-state power loss per arm vs forward current at various conduction angles, square wave, 50/60Hz 6/10 MP03 XXX 330 Series Maximum permissible case temperature - (C) 140 120 100 80 60 40 20 30 0 0 50 100 60 90 120 300 180 350 400 150 200 250 Mean on-state current - (A) Fig. 7 Maximum permissible case temperature vs forward current per arm at various conduction angles, sine wave, 50/60Hz Maximum permissible case temperature - (C) 140 120 100 d.c. 80 60 40 20 30 0 0 50 100 60 90 120 300 180 350 400 150 200 250 Mean on-state current - (A) Fig. 8 Maximum permissible case temperature vs forward current per arm at various conduction angles, square wave, 50/60Hz 7/10 MP03 XXX 330 Series 1400 0.04 1200 1000 800 600 400 200 0 0.10 0.12 0.15 0.20 0.30 0.40 0.08 L - Load 0.02 Rth(hs-a) C/W R - Load Total power - (W) 20 0 40 60 80 100 120 Maximum ambient temperature - (C) 140 0 200 400 D.C. output current - (A) 600 Fig. 9 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 1400 1200 0.08 Total power - (W) 0.04 0.02 Rth(hs-a) C/W R & L- Load 1000 800 600 400 200 0 0.10 0.12 0.15 0.20 0.30 0.40 20 0 40 60 80 100 120 Maximum ambient temperature - (C) 140 0 200 400 D.C. output current - (A) 600 Fig. 9 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various values of heatsink thermal resistance. (Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal). 8/10 MP03 XXX 330 Series PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 42.5 O5.5 35 28.5 5 K2 G2 5 50 38 G1 K1 80 2 3 2.8x0.8 3x M8 1 52 32 92 Recommended fixings for mounting: Recommended mounting torque: Recommended torque for electrical connections: Maximum torque for electrical connections: Nominal weight: 950g M5 socket head cap screws. 5Nm (44lb.ins) 8Nm (70lb.ins) 9Nm (80lb.ins) Module outline type code: MP03 CIRCUIT CONFIGURATIONS G1K1 1 2 HBT K2 G2 3 G1K1 1 2 HBP 3 K2 G2 1 2 HBN 3 5 6.5 18 9/10 MP03 XXX 330 Series http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4483-5 Issue No. 5.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 10/10 |
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